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Types of methods for protecting PCB vias

 

IPC-4761 (Design Guide for Protection of Printed Board Via Structures) defines several types of methods for protecting PCB vias. These are:

Type I: Tented

Type I: Tented

I(a) single sided

I(b) double sided

Dry film solder mask is stretched over the hole. No other materials are added.

Type III: Plugged

Type III: Plugged

III(a) single sided

III(b) double sided

A non-conductive material (resin) penetrates partially into the hole, but does not go all the way through.

Type V:Filled

Type V: Filled

Fully plugged. A conductive (silver or copper, plugging materials with metal particles) or non-conductive material (resin) penetrates completely into the hole, filling the hole all the way through.

Type II: Tented and covered

Type II: Tented and covered

II(a) single sided

II(b) double sided

An additional dry film or liquid solder mask layer covers the tenting of a Type I tented via.

Type IV: Plugged and covered

Type IV: Plugged and covered

IV(a) single sided

IV(b) double sided

An additional dry film or liquid solder mask layer covers the plugging of a Type III plugged via.

Type VI:Filled and covered

Type VI: Filled and covered

Fully plugged.An additional dry film or liquid solder mask layer covers the filled material of a Type V filled via.

Type VII:Filled and capped

Type VII: Filled and capped

A metalized coating covers the filled material of a Type V filled via. The metallization is on both sides

The capped vias technology requires the hole to be filled with resin or copper and then plated. Via-In-Pad and Ball-on-Via pad in used.

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